TEM and EDS investigation of heterogeneous interfaces in cofired multilayer ceramic capacitors

Accurate High Speed Empirically Based Predictive Modeling Of Deeply Embedded Gridded Parallel Plate - Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technol

A novel technique is presented for the accurate, rapid, high frequency, predictive modeling of parallel plate capacitors with gridded plates manufactured in a multilayer low temperature cofired ceramic (LTCC) process. The method is empirical in nature and is based on the concept of incrementally constructing the model for a structure from well characterized individual building blocks. Building ...

Crack initiation patterns at electrode edges in multilayer ferroelectric actuators

In multilayer ferroelectric actuators, electrode edges are the main source of fracture due to the generation of non-uniform electric fields in their vicinity. The electric fields, in turn, induce incompatible strain fields and hence concentrated stresses, which may cause the ceramic to crack. In this paper, the crack initiation from the electrode edges is simulated using a phase-field model. Th...

Screening Techniques for Ceramic Capacitors Guidelines for Selection, Screening and Qualification of Low-Voltage Commercial Multilayer Ceramic Capacitors for Space Programs

Statistical Modeling of 3 - D Parallel - Plate Embedded Capacitors Using Monte Carlo Simulation

Examination of the statistical variation of integrated passive components is crucial for designing and characterizing the performance of multichip module (MCM) substrates. In this paper, the statistical analysis of parallel plate capaci-tors with gridded plates manufactured in a multilayer low temperature cofired ceramic (LTCC) process is presented. A set of integrated capacitor structures is f...

Thin-film passives in RF/microwave circuits

Until recently, most microwave capacitors were based on fired multilayer ceramic technology. In this process, layers of highly conductive electrode metal alloys are interleaved with low-loss ceramic dielectrics in a multilayer fashion until the target capacitance is obtained. The resulting stack is then sintered into a monolithic structure in a high-temperature firing process. This process cont...